Boyd, a leading global innovator of engineered materials and thermal management technologies, announced recently acquiring Sensata’s Thermal Test and Controls business (TTCB).
Sensata specializes in the design and manufacture of advanced thermal systems, adapters, and sockets that are critical to the thermal testing process for high-end logic and semiconductor memory. Provided the firm’s long history of serving leading global semiconductor companies, this addition complements Boyd’s existing thermals business, which includes air- and liquid-cooled thermal management technologies.
Boyd sources added that it designs and manufactures complex thermal solutions for high-performance semiconductors used in applications such as 5G, hyperscale data centers, e-mobility, and artificial intelligence. With this acquisition, Boyd expands its offering to its current semiconductor clientele with the addition of advanced control capabilities and thermal test systems essential to the production of high-end memory and logic devices.
Doug Britt, Boyd CEO stated “This acquisition is a natural fit for Boyd and expands our portfolio of thermal solutions for leading semiconductor companies. With Sensata’s leading-edge technologists, materials scientists, and solutions from its Thermal Test and Controls business, Boyd expands its presence in the fast-growing semiconductor industry.”
Boyd sources further explained that the acquired firm will operate under the Boyd brand name – under which proven innovations have existed for almost 100 years. We have completed the acquisition of the company, except in South Korea, which is pending the usual regulatory approvals.
