Dai Nippon Printing Co., Ltd. has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces conventional resin substrates (ex. FC-BGA: Flip Chip-Ball Grid Array) with a glass substrate. Through the use of high-density Through Glass Via (TGV), it is now possible to provide a higher performance semiconductor package than that based on currently available technology. In addition, by adapting our panel manufacturing process, the new product can also support demands for high efficiency and large-scale substrate.
Fine pitch and high reliability
The newly developed GCS includes a TGV necessary for electrically connecting the fine metal wiring configured on the front and back of the glass. It is a Conformal Type glass substrate in which a metal layer is adhered to the side walls of the via. Our new proprietary manufacturing method enhances the adhesion between glass and metal, which was difficult to achieve with conventional technology, to realize fine pitch and high reliability.
High aspect ratio and large-scale
The newly developed glass substrate has an aspect ratio of 9+, and maintains sufficient adhesive qualities to configure fine wiring. As there are few restrictions regarding the thickness of the glass substrate used, it is possible to boost the degree of freedom when designing warpage, rigidity, and flatness. It is also possible to accommodate package scalability by employing our panel manufacturing process.
In addition to the existing Filling Type glass substrate that fills the glass Via with copper, DNP is also promoting the scalability of the newly developed Conformal Type glass substrate to a panel size of 510 x 515mm. We aim for sales of 5.0 billion yen in FY 2027.
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